So is: Micron, DDR4, 1Gb density, x16 organization, 78-ball FBGA, 1600 MT/s speed, extended temp range, stepping B. Chapter 3: The NAND Mystery – A Different Beast But not all Micron chips speak the same language. NAND flash parts (SSDs, USB drives) follow another dialect.
| Position | Characters | Meaning | Decoded value | |----------|------------|---------|----------------| | 1-2 | MT | Manufacturer | | | 3-4 | 40 | Family | DDR4 SDRAM (40 = DDR4, 41 = DDR3, 42 = DDR5, etc.) | | 5 | A | Die revision | Rev A (silicon mask version) | | 6 | 1G | Density | 1 Gb (gigabit) – Note: 1G = 1 gigabit, not gigabyte | | 8-9 | 16 | Organization | x16 (16 data I/O pins) – options: x4, x8, x16 | | 10-11 | RC | Package & FBGA code | RC = 78-ball FBGA, lead-free, halogen-free | | 12 | - | Separator | Just a dash | | 13-15 | 062 | Speed grade | 062 = 1.6 ns = 1250 Mbps (DDR4-1600? Wait, careful: 062 actually means 0.625 ns? Let’s check — for DDR4, 062E means tCK=0.625ns → 1600 MT/s. Yes.) | | 16 | E | Temperature & grade | E = Extended temperature (-25°C to 95°C) – T=Industrial, C=Commercial | | 17 | : | Separator | Colon | | 18 | B | Stepping | B = Component revision (like firmware for hardware) | micron memory part number decoder
Why? Because the cipher teaches respect for the complexity inside each chip. A DRAM cell is a capacitor that holds 30,000 electrons. There are 16 billion such cells on a single die. And the part number is your only map. With DDR5, HBM3, and CXL memory, Micron’s part numbers now include symbols for power management, ECC, and even security features. The string is getting longer. The decoder must evolve. So is: Micron, DDR4, 1Gb density, x16 organization,